Materials issues in microelectromechanical systems (MEMS)

Acta Materialia

Volumn 48, Issue 1, 2000, Pages 179-196

  Spearing, S M ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; COST BENEFIT ANALYSIS; ELECTRIC PROPERTIES; MATERIALS SCIENCE; MECHANICAL PROPERTIES; MICROELECTRONIC PROCESSING; MICROELECTRONICS;

MATERIAL SELECTION; MICROELECTROMECHANICAL SYSTEMS; MICROFABRICATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0033897055     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00294-3     Document Type: Article

References (122)

1. Gabriel K.J. Proc. I.E.E.E. 86:1998;1534.
2. Paula G. Mech. Engng. 118:1996;64.
3. Horsley D.A., Horowitz R., Pisano A.P. IEEE-ASME Trans. Mechatronics. 3:1998;175.
4. Epstein A.H., Senturia S.D. Science. 276:1997;1211.
5. Srinivasan, R., Firebaugh, S. L., Hsing, I.-M., Ryley, J., Harold, M. P., Jensen, K. F. and Schmidt, M. A., Proceedings, Transducers '97, 1997 International Conference on Solid-State Sensors and Actuators, Chicago, June 1997, pp. 163-166.
6. Bisson, C., Campbell, J., Cheadle, R., Chomiak, M., Lee, J., Miller, C., Milley, C., Pialis, P., Shaw, S., Weiss, W. and Widrig, C., Proceedings, Solid State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, 8-11 June 1998, pp. 1-6.
7. Henry S., McAllister D.V., Allen M.G., Prausnitz M.R. J. Pharmaceut. Sci. 87:1998;922.
8. Berlin A.A., Gabriel K.J. I.E.E.E. Comput. Sci. Engng. 4:1997;12.
9. Olivas J.D., Bolin S. JOM. 50:1998;38.
10. Arzt E. Acta mater. 46:1998;5611.
11. Bhusan, B. (ed.), Tribology Issues and Opportunities in MEMS, Proceedings of the NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS, Columbus, OH, 9-11 November 1997. Kluwer, Dordrecht, 1998.
12. Brown S., Gilbert J., Guckel H., Howe R., Johnson G., Krulevitch P., Muhlstein C. Microelectromechanical Structures for Materials Research. Mater. Res. Soc. Symp. Proc. Vol. 518:1998.
13. Heuer A.H., Jacobs S.J. Materials Science of Microelectromechanical Systems (MEMS) Devices. Mater. Res. Soc. Symp. Proc. Vol. 546:1999.
14. Wise K.D. Integrated Sensors, Microactuators, and Microsystems (MEMS). Proc. I.E.E.E. Vol. 86:1998.
15. Fukuda T., Menz W. Handbook of Sensors and Actuators. Micro Mechanical Systems: Principles and Technology. Vol. 6:1998;Elsevier, Amsterdam.
16. Trimmer W. Micromechanics and MEMS: Classic and Seminal Papers to 1990. 1997;IEEE Press, New York.
17. Madou M.J. Fundamentals of Microfabrication. 1997;CRC Press, Boca Raton, FL.
18. Freund L.B. J. appl. Mech. 54:1987;553.
19. Nix W.D. Metall. Trans. 20A:1989;2217.
20. Keller R.-M., Baker S.P., Arzt E. J. Mater. Res. 13:1998;1307.
21. Rösler J., Arzt E. Acta metall. 38:1990;671.
22. Spearing S.M., Chen K.-S. Ceram. Engng Sci. Proc. 18:(4):1997;11.
23. Bustillo J.M., Howe R.T., Muller R.S. Proc. I.E.E.E. 86:1998;1552.
24. Souloff, R. E., Tribology Issues and Opportunities in MEMS, Proceedings of the NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS, Columbus, OH, 9-11 November 1997, ed. B. Bhusan. Kluwer, Dordrecht, 1998.
25. Van Kessel P.F., Hornbeck L.J., Meier R.E., Douglass M.R. Proc. I.E.E.E. 86:1998;1687.
26. Kovacs G.T.A., Maluf N.I., Petersen K.E. Proc. I.E.E.E. 86:1998;1536.
27. Esashi M., Sugiyama S., Ikeda K., Wang Y.L., Miyashita H. Proc. I.E.E.E. 86:1998;1627.
28. Bassous E., Taub H.H., Kuhn L. Appl. Phys. Lett. 31:1977;135.
29. Ehrfeld W., Bley P., Götz F., Hagmann P., Maner A., Mohr J., Moser H.O., Munchmeyer D., Schelb W. Trimmer W. Micromechanics and MEMS: Classic and Seminal Papers to 1990. A selected reprint volume. 1997;623-633 IEEE Press, New York.
30. Mohr J. Sensors Mater. 10:1998;363.
31. Ruprecht R., Hanemann T., Piotter V., Hausselt J. Microsyst. Technol. 5:1998;44.
32. Chaudhuri B., Guckel H., Klein J., Fischer K. Microsyst. Technol. 4:1998;159.
33. Keller, C. G. and Howe, R. T., Transducers '95, Stockholm, Sweden, 1995, pp. 99-102.
34. Hui, E. E., Keller, C. G. and Howe, R. T., Solid-State Sensor and Actuator Workshop, South Carolina, 8-11 June 1998, pp. 256- 260.
35. Dewa, A. S., Deng, K., Ritter, D. C., Bonham, C. and Guckel, H., Proc. Transducers '97. IEEE, 1997, pp. 757-760.
36. Madou M.J. Fundamentals of Microfabrication. 1997;405-447 CRC Press, Boca Raton, FL.
37. Ashby M.F. Materials Selection in Mechanical Design. 1992;Pergamon Press, Oxford.
38. Saito T., Sato E., Matsuoka M., Iwakura C. J. appl. Electrochem. 28:1998;559-563.
39. Balaraju J.N., Seshadri S.K. J. Mater. Sci. Lett. 17:1998;1297.
40. Mehregany M., Zorman C.A., Rajan N., Wu C.H. Proc. I.E.E.E. 86:1998;1594.
41. Choyke W.J., Hiroyuki M., Pensl G. Silicon Carbide, a Review of Fundamental Questions and Applications to Current Device Technology I. 1997;Akademie Verlag, Berlin.
42. Choyke W.J., Hiroyuki M., Pensl G. Silicon Carbide, a Review of Fundamental Questions and Applications to Current Device Technology II. 1997;Akademie Verlag, Berlin.
43. Barrett D.L., McHugh J.P., Hobgood H.M., Hopkins R.H., McMullin P.G., Clarke R.C., Choyke W.J. J. Cryst. Growth. 128:1993;358.
44. Okojie, R. S., Ned, A. A. and Kurtz, A. D., Proc. Transducers '97. IEEE, 1997, pp. 1407-1418.
45. Rajan, N., Mehregany, M., Zorman, C. A. and Kicher, T. P., Proc. Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, 1998, pp. 31-34.
46. Flannery A.F., Mourlas N.J., Storment C.W., Tsai S., Tan S.H., Heck J., Monk D., Kim T., Gogoi B., Kovacs G.T.A. Sensors Actuators A. 70:1998;48.
47. Butler J.E., Windischmann H. MRS Bull. 23:1998;22.
48. Kitabatake M., Deguchi M. Sensors Mater. 11:1999;1.
49. Boone, T. D., Hooper, H. H. and Soane, D. S., Proceedings Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, 1988, pp. 87-92.
50. Brittain S., Paul K., Zhao X.M., Whitesides G. Physics World. 11:1998;31.
51. Epstein, A. H., Senturia, S. D., Al-Midani, O., Anathasuresh, G., Ayon, A., Breuer, K., Chen, K.-S., Ehrich, F.E., Esteve, E., Frechette, L., Gauba, G., Ghodssi, R., Groshenry, C., Jacobson, S., Kerrebrock, J. L., Lang, J. H., Lin, C.-C., London, A., Lopata, J., Mehra, A., MurMiranda, J. O., Nagle, S., Orr, D.J., Piekos, E., Schmidt, M.A., Shirley, G., Spearing, S.M., Tan, C. S., Tzeng, Y.-S. and Waitz, I., AIAA Paper AIAA-97-1773, Presented at 28th AIAA Fluid Dynamics Conference/4th AIAA Shear Flow Control Conference, Snowmass Village, CO, 29 June-2 July 1997.
52. Tang W.C., Nguyen T.C.H., Judy M.W., Howe R.T. Sensors Actuators A. 21:1990;328.
53. Ye W., Mukherjee S., MacDonald N.C. J. Microelectromech. Syst. 7:1998;16.
54. Mehregany M., Senturia S.D., Lang J.H., Nagarkar P. I.E.E.E. Trans. Electronic Devices. 39:1992;2060.
55. Sniegowski J.J., Garcia E.J. I.E.E.E. Electronic Device Lett. 17:1996;366.
56. Ahn C.H., Allen M.G. I.E.E.E. Trans. Ind. Electronics. 45:1998;866.
57. Park J.Y., Allen M.G. J. Micromech. Microengng. 8:1998;307.
58. Busch-Vishniac I. J. Sensors Actuators A. A33:1992;207.
59. Flynn A.M., Tavrow L.S., Bart S.F., Brooks R.A., Ehrlich D.J., Udayakumar K.R., Cross L.E. J. Microelectromech. Syst. 1:1992;44.
60. Yoshino Y. Mater. Res. Soc. Symp. Proc. 518:1998;9.
61. Wang S.N., Li J.F., Li X.H., Esashi M. Sensors Mater. 10:1998;375.
62. Hirata, Y. H., Okuyama, S., Numazawa, T. and Takada, H., Proc. IEEE Micro Electromechanical Systems (MEMS '95), Amsterdam, The Netherlands, 1995, pp. 191-195.
63. Lee I., Sung H.I. Exp. Fluids. 26:1999;27.
64. Krulevitch, P., Lee, A. P., Ramsey, P. B., Trevino, J. and Northrup, M. A., DSC 59 Microelectromechanical Systems (MEMS), ASME, 1996, pp. 301-306.
65. Kahn H., Huff M.A., Heuer A.H. J. Micromech. Microengng. 8:1998;213.
66. Rombach R., Langheinrich W. Sensors Actuators A. A41-42:1994;410.
67. Tian C.Y., Jia N.Q., Wang R., Zhang Z.R., Zhu J.Z., Zhang G.X. Sensors Actuators B. 52:1998;119.
68. Butler J.E., Windischmann H. MRS Bull. 23:1998;22.
69. Palmour J.W., Tsvetkov V.F., Lipkin L.A., Carter C.H. Compound Semiconductors. 141:1995;377.
70. Taniguchi J., Miyamoto I., Ohno N., Kantani K., Komuro M., Hiroshima H. Japan J. appl. Phys., Pt 1. 36:1997;7691.
71. Ghandhi S.K. VLSI Fabrication Principles: Silicon and Gallium Arsenide. 2nd edn :1994;John Wiley, New York.
72. Rembetski J.F., Rust W., Shepherd R. Solid St. Technol. 38:1995;67.
73. Ayon A.A., Braff R., Lin C.C., Sawin H.H., Schmidt M.A. J. Electrochem. Soc. 146:1999;339.
74. Daschner W., Long P., Larsson M., Lee S.H. J. Vacuum Sci. Technol. B. 13:1995;2729.
75. Schmidt M.A. Proc. I.E.E.E. 86:1998;1575.
76. Tong Q.Y. Semiconductor Wafer Bonding: Science and Technology. 1998;John Wiley, New York.
77. Maszara W.P. Microelectron. Engng. 22:1993;299.
78. Bengtsson S.J. Electron. Mater. 21:1992;841.
79. Wolffenbuttel R.F., Wise K.D. Sensors Actuators A. A43:1994;223.
80. Ristic L.J. Sensor Technology and Devices. 1994;Artech House, Boston, MA. Chap. 5/6.
81. Ko W.H., Suminto J.T., Yeh G.J. Fung C.D., Cheung P.W., Ko W.H., Fleming D.G. Micromachining and Micropackaging of Transducers. 1985;41-61 Elsevier, Amsterdam.
82. Anthony T.R. J. appl. Phys. 54:1983;2419.
83. Maszara W.P. J. Electrochem. Soc. 138:1991;341.
84. Imthurn G.P., Garcia G.A., Walker H.W., Forbes L. J. appl. Phys. 72:1992;2526.
85. Gui C., Elwenspoek M., Gardeniers J.G.E., Lambeck P.V. J. Electrochem. Soc. 145:1998;2198.
86. Wiesner J.R. Solid St. Technol. 36:1993;63.
87. Senturia S.D. Proc. I.E.E.E. 86:1998;1611.
88. Senturia, S. D., Sensor Actuators A, 1998, 1.
89. Senturia S.D. Trimmer W. Micromechanics and MEMS: Classic and Seminal Papers to 1990. A selected reprint volume. 1997;659-663 IEEE Press, New York.
90. Osterberg P.M., Senturia S.D. J. Microelectromech. Syst. 6:1997;107.
91. Wilson C.J., Beck P.A. J. Microelectromech. Syst. 5:1996;142.
92. Vlassak J.J., Nix W.D. J. Mater. Res. 7:1992;3242.
93. Lu M.S.-C., Zhu X., Fedder G.K. Mater. Res. Soc. Symp. Proc. 518:1998;27.
94. Vlassak J.J., Nix W.D. J. Mater. Res. 7:1992;3242.
95. Ziebart, V., Baltes, H. and Paul, O., Mater. Res. Soc. Symp. Proc., 1999, 546, 103.
96. Sharpe W.N., Brown S., Johnson G.C., Knauss W. Mater. Res. Soc. Symp. Proc. 518:1998;57.
97. Chen, K.-S., Ayon, A. A., Lohner, K. A., Kepets, M. A., Melconian, T. K. and Spearing, S. M., Mater. Res. Soc. Symp. Proc., 1999, 546, 51.
98. Nix W.D. Mater. Sci. Engng A. 234:1997;37.
99. Turner K., Edwards R.L. Mater. Res. Soc. Symp. Proc. 518:1998;191.
100. Ballarini R., Mullen R.L., Kahn H., Heuer A.H. Mater. Res. Soc. Symp. Proc. 518:1998;137.
101. Chen, K.-S., Ayon, A. and Spearing, S. M., J. Am. Ceram. Soc., in press.
102. Sharpe, W. N., Turner, K. T. and Edwards, R. L., Exp. Mech., 1999, 39, 162.
103. Huff M.A., Nikolich A.D., Schmidt M.A. J. Microelectromech. Syst. 2:1993;74.
104. Allen M.G., Senturia S.D. J. Adhesion. 25:1988;303.
105. Bagchi A., Lucas G.E., Suo Z., Evans A.G. J. Mater. Res. 9:1994;1734.
106. Fitzgerald, A. M., Dauskardt, R. H. and Kenny, T. W., Proc. Transducers 99, Sendai, Japan, 1999, in press.
107. Ohring M. The Materials Science of Thin Films. 1992;413-438 Academic Press, London.
108. Smith D.L. Thin Film Deposition: Principles and Practice. 1995;196-197 McGraw-Hill, New York.
109. Evans A.G., Hutchinson J.W. Acta mater. 43:1995;2507.
110. Allen M.G., Mehregany M., Howe R.T., Senturia S.D. Appl. Phys. Lett. 51:1987;241.
111. Zhang X., Zhang T.Y., Zohar Y. Thin Solid Films. 335:1998;97.
112. Hommel, M., Kraft, O., Arzt, E. and Baker, S. P., Mater. Res. Soc. Symp. Proc., 1999, 546, 133.
113. Cornella G., Vinci R.P., Suryanarayanan Iyer R., Dauskardt R.H. Mater. Res. Soc. Symp. Proc. 518:1998;81.
114. Muhlstein C.L., Brown S.B. Bhusan B. Tribology Issues and Opportunities in MEMS. 1998;529-537 Kluwer, Dordrecht.
115. Souloff, R. E., in Tribology Issues and Opportunities in MEMS, Proceedings of the NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS, Columbus, OH, 9-11 November 1997, ed. B. Bhusan. Kluwer, Dordrecht, 1998.
116. Sniegowski J.J., Garcia E.J. I.E.E.E. Electron. Device Lett. 17:1996;366.
117. Rymuza, Z., Microsystems Technologies, 1999, 5, 173.
118. Lee S.-H., Kwon M.-J., Park J.-G., Kim Y.-K., Shin H.-J. Mater. Res. Soc. Symp. Proc. 518:1998;143.
119. Lin, C. C., Ghodssi, R., Ayon, A. A., Chen, D.-Y. and Schmidt, M. A., Solid-State Sensor and Actuator Workshop, Late News Poster Session Supplemental Digest, 1998, pp. 25-26.
120. Whitesides G. Technol. Rev. 101:1998;84.
121. Drexel K.E. Nanosystems, Molecular Machines, Manufacturing and Computation. 1992;Wiley, New York.
122. Tada H., Abramson A.R., Nieva P., Zavracky P., Miaoulis I.N., Wong P.Y. Mater. Res. Soc. Symp. Proc. 518:1998;161.