Silicon carbide MEMS for harsh environments

Proceedings of the IEEE

Volumn 86, Issue 8, 1998, Pages 1594-1609

  Mehregany, Mehran ^a   Zorman, Christian A ^a   Rajan, Narayanan ^a   Wu, Chien Hung ^a  

^a Case Western Reserve University   (United States)

Author keywords

Harsh environments; High temperature sensors; MEMS; SiC processing technology; Silicon carbide

Indexed keywords

MECHANICAL PROPERTIES; MICROELECTRONIC PROCESSING; SENSORS; SILICON CARBIDE; TECHNOLOGY;

HARSH ENVIRONMENTS; MICROELECTROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0032139423     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.704265     Document Type: Article

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