Mechanical property measurement of 0.5-μm CMOS microstructures

Materials Research Society Symposium - Proceedings

Volumn 518, Issue , 1998, Pages 27-32

  Lu, M S C ^a   Zhu, X ^a   Fedder, G K ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPOSITE MICROMECHANICS; CRACK PROPAGATION; ELASTIC MODULI; FATIGUE OF MATERIALS; MECHANICAL PROPERTIES; MECHANICAL TESTING; MECHANICAL VARIABLES MEASUREMENT; MICROSTRUCTURE; REACTIVE ION ETCHING; RESIDUAL STRESSES;

DIELECTRIC CONTENT; VERTICAL STRESS GRADIENT;

CMOS INTEGRATED CIRCUITS;

EID: 0032304273     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-518-27     Document Type: Conference Paper

References (11)