MEMS as temperature sensors during high temperature processing

Materials Research Society Symposium - Proceedings

Volumn 518, Issue , 1998, Pages 161-166

  Tada, H ^a   Abramson, A R ^a   Nieva, P ^a   Zavracky, P ^a   Miaoulis, I N ^a   Wong, P Y ^a  

^a TUFTS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE PROPERTIES; MATHEMATICAL MODELS; MICROELECTRONICS; PERFORMANCE; PHYSICAL PROPERTIES; SENSORS; THERMAL EXPANSION; THERMOCOUPLES; THERMODYNAMIC PROPERTIES; TRANSPARENCY;

PARTIAL TRANSPARENCY LIMIT; THERMAL CONTACT;

MICROELECTROMECHANICAL DEVICES;

EID: 0032296745     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-518-161     Document Type: Conference Paper

References (12)