Vacuum-sealed silicon micromachined pressure sensors

Proceedings of the IEEE

Volumn 86, Issue 8, 1998, Pages 1627-1638

  Esashi, Masayoshi ^a,e   Sugiyama, Susumu ^b   Ikeda, Kyoichi ^c   Wang, Yuelin ^d   Miyashita, Haruzo ^e  

^a TOHOKU UNIVERSITY   (Japan)

^b RITSUMEIKAN UNIVERSITY   (Japan)

^c YOKOGAWA ELECTRIC CORPORATION   (Japan)

^d ZHEJIANG UNIVERSITY   (China)

^e Canon ANELVA Technix Corporation   (Japan)

Author keywords

Pressure sensor; Silicon micromachining; Vacuum seal

Indexed keywords

BONDING; CAVITY RESONATORS; CHEMICAL VAPOR DEPOSITION; DIELECTRIC FILMS; ELECTROSTATICS; HYDROGEN; MICROMACHINING; SEALING (CLOSING); SYSTEM STABILITY; THERMAL DIFFUSION; VACUUM TECHNOLOGY;

ELECTROSTATIC FORCE BALANCING; PRESSURE SENSOR; SILICON DIAPHRAGM; VACUUM SEALING;

SILICON SENSORS;

EID: 0032136371     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.704268     Document Type: Article

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