Dependence of silicon fracture strength and surface morphology on deep reactive ion etching parameters

Materials Research Society Symposium - Proceedings

Volumn 546, Issue , 1999, Pages 21-26

  Chen, Kuo Shen ^a   Ayon, Arturo A ^a   Lohner, Kevin A ^a   Kepets, Mark A ^a   Melconian, Terran K ^a   Spearing, S Mark ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE TOUGHNESS; GAS TURBINES; MICROELECTROMECHANICAL DEVICES; MORPHOLOGY; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SINGLE CRYSTALS; STRESSES;

DEEP REACTIVE ION ETCHING (DRIE);

SILICON;

EID: 0033337887     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)