Present and future role of chemical mechanical polishing in wafer bonding

Journal of the Electrochemical Society

Volumn 145, Issue 6, 1998, Pages 2198-2204

  Gui, C ^a   Elwenspoek, M ^a   Gardeniers, J G E ^a   Lambeck, P V ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; MORPHOLOGY; SUBSTRATES; THIN FILMS;

CHEMICAL MECHANICAL POLISHING; DIRECT WAFER BONDING;

CHEMICAL POLISHING;

EID: 0032094951     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838616     Document Type: Article

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