Fracture testing of bulk silicon microcantilever beams subjected to a side load

Journal of Microelectromechanical Systems

Volumn 5, Issue 3, 1996, Pages 142-150

  Wilson, Carol J ^b,c,d,e,f   Beck, Patricia A ^{a,b,g,h,i,j,k,l,m}  

^a IEEE

^b HEWLETT PACKARD LABORATORIES   (United States)

^c WEST VIRGINIA UNIVERSITY   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e IBM   (United States)

^f ASME

^g RICHARD STOCKTON COLLEGE OF NEW JERSEY   (United States)

^h STANFORD UNIVERSITY   (United States)

ⁱ KITT PEAK NATIONAL OBSERVATORY   (United States)

^j LUCENT TECHNOLOGIES   (United States)

^k Hewlett Packard's Lightwave O ^*

^l ARCS Foundation Scholar

^m AMERICAN PHYSICAL SOCIETY   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; FRACTURE TESTING; FRACTURE TOUGHNESS; LOADS (FORCES); MATHEMATICAL MODELS; MECHANICAL TESTING; SEMICONDUCTING SILICON; STATISTICAL METHODS; STIFFNESS;

MICROCANTILEVER BEAMS; SIDE LOADING;

MICROELECTROMECHANICAL DEVICES;

EID: 0030246332     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.536620     Document Type: Article

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