Round-robin tests of modulus and strength of polysilicon

Materials Research Society Symposium - Proceedings

Volumn 518, Issue , 1998, Pages 57-65

  Sharpe Jr , W N ^a   Brown, S ^a   Johnson, G C ^a   Knauss, W ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BRITTLENESS; ELASTIC MODULI; MECHANICAL TESTING; MECHANICAL VARIABLES MEASUREMENT; STRENGTH OF MATERIALS;

IN PLANE BENDING; TENSILE MEASUREMENT;

SEMICONDUCTING SILICON;

EID: 0032292269     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)