Survey of high-temperature reliability of power electronics packaging components

IEEE Transactions on Power Electronics

Volumn 30, Issue 5, 2015, Pages 2456-2464

  Khazaka, R ^a   Mendizabal, L ^a   Henry, D ^a   Hanna, R ^b  

^a CEA GRENOBLE   (France)

^b Grenoble Electrical   (France)

Author keywords

Die attach; encapsulation; harsh environments; packaging; power semiconductor devices; reliability; substrate

Indexed keywords

CHIP SCALE PACKAGES; ENCAPSULATION; GAS INDUSTRY; INTEGRATED CIRCUIT INTERCONNECTS; OIL WELLS; PACKAGING; PACKAGING MATERIALS; POWER ELECTRONICS; RELIABILITY; SEMICONDUCTOR DEVICES; SILICON CARBIDE; SPACE RESEARCH; SUBSTRATES; THERMAL EXPANSION; WELL LOGGING;

DEGRADATION TEMPERATURES; DIE-ATTACH; HARSH ENVIRONMENT; HIGH-TEMPERATURE ELECTRONICS; LOW COEFFICIENT OF THERMAL EXPANSIONS; POWER SEMICONDUCTOR DEVICES; THERMOMECHANICAL RELIABILITY; WIDE-BAND-GAP SEMICONDUCTOR;

ELECTRONICS PACKAGING;

EID: 84920465118     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2014.2357836     Document Type: Article

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