Common metal die attachment for sic power devices operated in an extended junction temperature range

Materials Science Forum

Volumn 717-720, Issue , 2012, Pages 853-856

  Tanimoto, Satoshi ^a,b   Matsui, Kohei ^a,c   Zushi, Yusuke ^a,b   Sato, Shinji ^a,d   Murakami, Yoshinori ^a,b   Takamori, Masato ^e   Iseki, Takashi ^e  

^a R and D Partnership for Future Power Electronics Technology (FUPET)   (Japan)

^b NISSAN MOTOR CO   (Japan)

^c FUJI ELECTRIC CO   (Japan)

^d SANKEN ELECTRIC CO LTD   (Japan)

^e SUMITOMO METAL MINING CO LTD   (Japan)

Author keywords

Common metal; Die attachment; High temperature; Package; Power device; Solder; Zn Al

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; COPPER ALLOYS; COST EFFECTIVENESS; DIES; HIGH TEMPERATURE APPLICATIONS; LEAD-FREE SOLDERS; PACKAGING; SILICON CARBIDE; SOLDERING; ZINC ALLOYS;

COMMON METALS; DIE ATTACHMENT; HIGH TEMPERATURE; JUNCTION TEMPERATURES; POWER APPLICATIONS; POWER DEVICES; REPRODUCIBILITIES; SOLDERING PROCESS;

POWER SEMICONDUCTOR DEVICES;

EID: 84861366991     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.717-720.853     Document Type: Conference Paper

References (7)

1. J. Hornberger, A. B. Lostetter, K. J. Olejniczak, T. McNutt, S. Magan Lal and A. Mantooth: 2004 IEEE Aerospace Conference Proceedings (Big Sky, MT, USA, 2004), pp. 2583-2554.
2. P. Zheng, A. Wiggins, R. W. Hohnson, R. V. Frampton, S. J. Adam and L. Peltz: Proceedings, IMAPS International Conference and Exhibition on High Temperature Electronics 2008 (Albuquerque, NM, USA, 2008), pp. 213-219.
3. S. Tanimoto, K. Matsui, Y. Murakami, H. Yamaguchi and H. Okumura: Proceedings, IMAPS International Conference and Exhibition on High Temperature Electronics 2010 (Albuquerque, NM, USA, 2010), pp. 32-39.
4. T. Shimizu, H. Ishikawa, I. Ohnuma and K. Ishida: J. Electron. Mater., Vol. 28, p. 1172 (1999).
5. Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, I. Ohnuma and K. Ishida: ICEP 2009 Proceedings (Kyoto, Japan, 2009), pp. 696-699.
6. http://www.crct.polymtl.ca/FACT/phase-diagram.php?file=Al-Zn.jpg&dir= BINARY
7. International Standard IEC 60749-19.