Sintering of silver nanoparticles for the formation of high temperature interconnect joints

Materials Research Society Symposium Proceedings

Volumn 942, Issue , 2006, Pages 39-44

  Murray, A J ^a,b   Jaroenapibal, P ^c   Koene, B ^d   Evoy, S ^a,b  

^a UNIVERSITY OF ALBERTA   (Canada)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

^c UNIVERSITY OF PENNSYLVANIA   (United States)

^d LUNA INNOVATIONS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; HIGH PRESSURE EFFECTS; HIGH TEMPERATURE OPERATIONS; SHEAR STRENGTH; SILVER; SINTERING; THICK FILMS;

INTERCONNECT FABRICATION; INTERCONNECT JOINTS; SILVER NANOPARTICLES;

NANOPARTICLES;

EID: 33947665665     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0942-w08-29     Document Type: Conference Paper

References (7)

1. Z. Zhang, and G. Q. Lu, IEEE Trans. on Elec. Pack. Man., 25, 279 (2002).
2. G. Q. Lu, J. N. Noel, Z. Zhiye, and J. G. Bai, in A Lead-Free, Low-Temperature Sintering Die-Attach Technique for High-Performance and High-Temperature Packaging. (Proc. IEEE CPMT Conf. on High Dens. Microsys. Design and Packag. and Comp. Fail. Anal., HDP'04, 2004), p 42-46.
3. C. Chr. Schuler, A. Stuck, N. Beck, H. Keser, and U. J. Tack, J. Mater. Sci 11, 389 (2000).
4. S. Joo, D. F. Baldwin, Elec. Comp. and Tech. Conf. 2 1859 (2005).
5. S. B. Fuller, E. J. Wilhelm, and J. M. Jacobson, J. Micro. Elec. Mech. Sys. 11, 54 (2002).
6. K-S Chou, K-C Huang, and H-H Lee, Nanotechnology 16, 779 (2005).
7. R. Munamarty, P. McCluskey, M. Pecht, and L. Yip, Soldering Surf. Mount Technol. 8, 51 (1996).