Characterisation of power modules ceramic substrates for reliability aspects

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1260-1266

  Pietranico, S ^a   Pommier, S ^a   Lefebvre, S ^a   Khatir, Z ^b   Bontemps, S ^c  

^a CNRS   (France)

^b INRETS LTN   (France)

^c MICROSEMI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; CERAMIC LAYER; CERAMIC SUBSTRATES; CHARACTERISATION; ELECTRONIC POWER DEVICES; FAILURE CRITERIA; FATIGUE LIFE; GEOMETRIC SINGULARITY; LINEAR-ELASTIC FRACTURE MECHANICS; NATURAL DEFECT; POWER ELECTRONIC DEVICES; POWER MODULE; RISK OF FAILURE; TEMPERATURE VARIATION; THERMO-MECHANICAL; WEIBULL APPROACH; WORST CASE;

AIRCRAFT; CERAMIC MATERIALS; ELECTRIC POWER SYSTEMS; FATIGUE OF MATERIALS; FRACTURE MECHANICS; STRENGTH OF MATERIALS; SUBSTRATES; TEMPERATURE DISTRIBUTION;

BRITTLE FRACTURE;

EID: 69249215189     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.06.026     Document Type: Article

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