Development of an extreme temperature range silicon carbide power module for aerospace applications

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn , Issue , 2008, Pages 290-294

  Katsis, Dimosthenis C ^a   Zheng, Yunqi ^b  

^a Athena Energy Corp   (United States)

^b GENERAL MOTORS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NONMETALS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON CARBIDE;

MECHANICAL COMPONENTS; OPERATING TEMPERATURES; POWER MODULES; TEMPERATURE EXTREMES; TEMPERATURE RANGES;

POWER ELECTRONICS;

EID: 52349103016     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2008.4591943     Document Type: Conference Paper

References (5)

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3. 5. P. Cova, et al, "Power Cycling on Press-Pack IGBTs: Measurement and Thermomechanical Simulations", Microelectronics Reliability, vol. 39, pp. 1165-1170, 1999
4. Dirk D. Brown, et al, "An Adaptable, High Performance LGA Connector Technology", High Connection Density, Inc. super button LGA white paper
5. Y. Zheng and D. C. Katsis, " Investigation of Silicone-Based Encapsulants for a High Temperature Power Module", International Materials and Packaging Society Conference, IMAPS, Proceedings, Nov. 2007