Thermal fatigue and failure of electronic power device substrates

International Journal of Fatigue

Volumn 31, Issue 11-12, 2009, Pages 1911-1920

  Pietranico, S ^a   Pommier, S ^a   Lefebvre, S ^a   Pattofatto, S ^a  

^a CNRS   (France)

Author keywords

Aluminium nitride; Copper; Overloads; Variable amplitude fatigue; Weibull

Indexed keywords

A-THERMAL; ALUMINIUM NITRIDE; BASE PLATES; CERAMIC LAYER; DIRECT BONDED COPPERS; ELECTRONIC POWER DEVICES; FAILURE CRITERIA; FATIGUE LIFE; GEOMETRIC SINGULARITY; LINEAR-ELASTIC FRACTURE MECHANICS; NATURAL DEFECT; OVERLOAD CYCLES; OVERLOAD RETARDATION; OVERLOADS; POWER ELECTRONIC DEVICES; POWER MODULE; RISK OF FAILURE; SILICON DIE; STRESS FIELD; TEMPERATURE VARIATION; THERMAL AMPLITUDE; THERMO-MECHANICAL; VARIABLE AMPLITUDE FATIGUE; WEIBULL; WEIBULL APPROACH; WORST CASE;

AIRCRAFT; ALUMINUM; ALUMINUM COMPOUNDS; CERAMIC MATERIALS; COPPER; DECISION MAKING; ELECTRIC EQUIPMENT; ELECTRIC POWER SYSTEMS; FRACTURE MECHANICS; NITRIDES; RISK PERCEPTION; STRENGTH OF MATERIALS; STRESSES; SUBSTRATES; TEMPERATURE DISTRIBUTION; THERMAL FATIGUE;

BRITTLE FRACTURE;

EID: 68949163178     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijfatigue.2009.03.011     Document Type: Article

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