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1500 V, 4 amp 4H-SiC JBD diodes
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May
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Siliconcarbide merged PiN schottky diode switching characteristics and evaluation for power supply applications
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October
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SiC power diodes provide breakthrough performance for a wide range of applications
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March
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A.R. Heftier, R. Singh, J.S. Lai, D.W. Berning, S. Bouche, C. Chapuy, "SiC Power Diodes Provide Breakthrough Performance for a Wide Range of Applications," IEEE Trans. on Power Electronics, vol. 16 no. 2, pp. 273-280, March 2001.
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2, 1.6 kV power DiMOSFETs in 4H-SiC
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Siliconcarbide power die packaging in diamond substrate multichip power module applications
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Baltimore
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2001 IMAPS Conference
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Development of silicon-carbide (SiC) static-induction-transistor (SIT) based half-bridge power converters
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Boston, MA November
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A. Lostetter, J. Hornberger, S. Magan Lal, K. Olejniczak, A. Mantooth, and Aicha Elshabini "Development of Silicon-Carbide (SiC) Static-Induction-Transistor (SIT) Based Half-Bridge Power Converters" IMAPS 2003 International Symposium on Microelectronics, Boston, MA November 2003.
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An overview to integrated power module (IPM) design for power electronics packaging
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Silicon-carbide PiN, schottky, and merged PiN-schottky power diode models implemented in the saber circuit simulator
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Vancouver, Canada, June
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T. McNutt, A. Hetner, A. Mantooth, J. Duliere, D. Berning, R. Singh, "Silicon-Carbide PiN, Schottky, and Merged PiN-Schottky Power Diode Models Implemented in the Saber Circuit Simulator," Conf. Rec. of IEEE Power Electronics Specialists Conf (PESC), pp. 2103-2108, Vancouver, Canada, June 2001.
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17
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Modeling buffer layer IGBT's for circuit simulation
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2, 1.6 kV power DiMOSFETs in 4H-SiC
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Santa Fe, NM, June
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2, 1.6 kV Power DiMOSFETs in 4H-SiC," Proceedings of the International Symposium on Power Semiconductor Devices (ISPSD), Santa Fe, NM, June 2002.
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Ryu, S.H.1
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20
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NASA Venus Fact Sheet
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0343685892
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Electronic packaging for power electronic building blocks
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March
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R. Hoagland, A.B. Lostetter, and Elshabini, "Electronic Packaging for Power Electronic Building Blocks," in the Proc. of GOMAC, pp.433-436, March 1997.
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Hoagland, R.1
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