Optimal design of coating material for nanoparticles and its application for low-temperature interconnection

Journal of Nanoparticle Research

Volumn 12, Issue 6, 2010, Pages 2135-2144

  Tobita, Motoi ^a   Yasuda, Yusuke ^a   Ide, Eiichi ^a   Ushio, Jiro ^a   Morita, Toshiaki ^a  

^a HITACHI LTD   (Japan)

Author keywords

Coating material; Electronic industry; Interconnection; Nanoparticle; Silver nanoparticles

Indexed keywords

COATING MATERIAL; COPPER ELECTRODES; ELECTRONIC INDUSTRIES; LOW TEMPERATURES; METAL NANOPARTICLES; NANO-PARTICLE SILVER; OPTIMAL DESIGN; SECONDARY AMINES; SILVER NANOPARTICLES; SILVER SOLDER; THEORETICAL MODELS;

COATINGS; ELECTRODES; LEAD; NANOPARTICLES; PLATING; SHEAR STRENGTH; THERMAL CONDUCTIVITY; THERMOANALYSIS; TIN;

SILVER;

COPPER; SILVER NANOPARTICLE;

ARTICLE; CHEMICAL STRUCTURE; DECOMPOSITION; ELECTRODE; EQUIPMENT DESIGN; LOW TEMPERATURE; MATERIAL COATING; PRIORITY JOURNAL; SHEAR STRENGTH; THEORETICAL MODEL; THERMAL CONDUCTIVITY; VALIDITY;

EID: 77955012839     PISSN: 13880764     EISSN: 1572896X     Source Type: Journal    
DOI: 10.1007/s11051-009-9775-y     Document Type: Article

References (23)

1. JG Bai ZZ Zhang JN Calata, et al. 2006 Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material IEEE Trans Compon Packag Technol 29 589 593 10.1109/TCAPT.2005.853167 1:CAS:528:DC%2BD28XhtVWksrfN (Pubitemid 44375461)
2. L-F Chiu H-F Liu M-H Li 1999 Heat capacity of alkanolamines by differential scanning calorimetry J Chem Eng Data 44 631 636 10.1021/je980217x 1:CAS:528:DyaK1MXitl2isr0%3D
3. S-H Choi S-H Lee Y-M Hwang, et al. 2003 Interaction between the surface of the silver nanoparticles prepared by γ-irradiation and organic molecules containing thiol group Radiat Phys Chem 67 517 521 10.1016/S0969-806X(03)00097-5 1:CAS:528:DC%2BD3sXktFCqs7Y%3D 2003RaPC...67..517C (Pubitemid 36627965)
4. EUR-Lex (2008) Access to European Union law http://eur-lex.europa.eu/ LexUriServ/LexUriServ.do?uri=CELEX:32002L0095:EN:NOT accessed June 2008
5. A Gole SR Sainkar M Sastry 2000 Electrostatically controlled organization of carboxylic acid derivatized colloidal silver particles on amine-terminated self-assembled monolayers Chem Mater 12 1234 1239 10.1021/cm990439u 1:CAS:528:DC%2BD3cXitlyltr0%3D
6. I Hatta R Kato Maesono 1987 A development of ac calorimetric method for thermal diffusivity measurement. II. Sample dimension required for the measurement Jpn J Appl Phys 26 475 478 10.1143/JJAP.26.475 1:CAS:528: DyaL2sXhvVeltr0%3D 1987JaJAP..26..475H
7. JIS (2003) Test methods for lead-free solders. Part 5: methods for tensile tests and shear tests on solder joints. JIS Z 3198-5
8. Y Kashiwagi M Yamamoto M Nakamoto 2006 Facile size-regulated synthesis of silver nanoparticles by controlled thermolysis of silver alkylcarboxylates in the presence of alkylamines with different chain length J Colloid Interface Sci 300 169 175 10.1016/j.jcis.2006.03.041 1:CAS:528:DC%2BD28Xmt1aisLw%3D 16603175 (Pubitemid 44192466)
9. EJ Liang C Engert W Kiefer 1993 Surface-enhanced Raman spectroscopy of p-aminobenzoic acid with excitation in the visible and near infrared spectral region Vib Spectrosc 6 79 85 10.1016/0924-2031(93)87024-N 1:CAS:528: DyaK2cXovFGrsw%3D%3D
10. Lide DR Jr (ed) (1999) CRC hand book of chemistry and physics, 79th edn. CRC Press, Boca Raton, London; New York, Washington DC
11. Lu G-Q, Calata JN, Lei G et al. (2007) Low-temperature pressureless sintering technology for high-performance and high-temperature interconnection of semiconductor devices. In: IEEE 8th international conference on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, EuroSime 609-613
12. M Mahalingam 1985 Thermal management in semiconductor device packaging Proc IEEE 73 1396 1404 10.1109/PROC.1985.13300 1985IEEEP..73.1396M
13. MD Malinsky KL Kelly GC Schatz, et al. 2001 Chain length dependence and sensing capabilities of the localized surface plasmon resonance of silver nanoparticles chemically modified with alkanethiol self-assembled monolayers J Am Chem Soc 123 1471 1489 10.1021/ja003312a 1:CAS:528:DC%2BD3MXmslSgug%3D%3D (Pubitemid 32167339)
14. AJ Murray P Jaroenapibal B Koene, et al. 2006 Sintering of silver nanoparticles for the formation of high temperature interconnect joints Mater Res Soc Symp Proc 942 39 44
15. PG Neudeck RS Okojie L-U Chen 2002 High-temperature electronics-a role for wide bandgap semiconductors? Proc IEEE 90 1065 1076 10.1109/JPROC.2002. 1021571 (Pubitemid 43785873)
16. NIST (2005) NIST chemistry webbook. http://webbook.nist.gov/chemistry/. Accessed May 2008
17. KV Sarathy G Raina RT Yadav, et al. 1997 Thiol-derivatized nanocrystalline arrays of gold, silver, and platinum J Phys Chem B 101 9876 9880 10.1021/jp971544z 1:CAS:528:DyaK2sXntVynur4%3D
18. M Sastry KS Mayya V Patil, et al. 1997 Langmuir-Blodgett films of carboxylic acid derivatized silver colloidal particles: role of subphase pH on degree of cluster incorporation J Phys Chem B 101 4954 4958 10.1021/jp964087f 1:CAS:528:DyaK2sXjs1WmtLg%3D
19. DM Thornburg RJ Madix 1990 Cleavage of NH bonds by active oxygen on Ag(110): II. Selective oxidation of ethylamine to acetonitrile Surf Sci 226 61 10.1016/0039-6028(90)90154-Z 1:CAS:528:DyaK3cXkt1artLk%3D 1990SurSc.226...61T
20. M Tobita Y Yasuda 2008 Theoretical and experimental vibrational characterization of amine-coated silver nanoparticles J Phys Chem C 112 13851 13855 10.1021/jp803195e 1:CAS:528:DC%2BD1cXpvFSnurs%3D
21. TC Wang MF Rubner RE Cohen 2002 Polyelectrolyte multilayer nanoreactors for preparing silver nanoparticle composites: controlling metal concentration and nanoparticle size Langmuir 18 3370 3375 10.1021/la015725a 1:CAS:528:DC%2BD38Xhs1Citrg%3D (Pubitemid 35383802)
22. X Xu VA Sankaran 1993 Power electronics in electric vehicles: challenges and opportunities Proc Ind Appl Soc Annu Meet 1 463 469
23. M Yamamoto Y Kashiwagi M Nakamoto 2006 Size-controlled synthesis of monodispersed silver nanoparticles capped by long-chain alkyl carboxylates from silver carboxylate and tertiary amine Langumuir 22 8581 8586 10.1021/la0600245 1:CAS:528:DC%2BD28XptVylt7s%3D (Pubitemid 44549988)