Evaluation of encapsulation materials for high-temperature power device packaging

IEEE Transactions on Power Electronics

Volumn 29, Issue 5, 2014, Pages 2281-2288

  Locatelli, Marie Laure ^a   Khazaka, Rabih ^a   Diaham, Sombel ^a   Pham, Cong Duc ^a   Bechara, Mireille ^a   Dinculescu, Sorin ^a   Bidan, Pierre ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

Dielectric measurements; elastomer; encapsulation; packaging; power semiconductor devices; silicone gel

Indexed keywords

DC ELECTRICAL CONDUCTIVITY; DIELECTRIC MEASUREMENTS; ELECTRICAL CHARACTERISTIC; HIGH-TEMPERATURE POWER; POWER SEMICONDUCTOR DEVICES; SILICON CARBIDE COMPONENTS; SILICONE GELS; TEMPERATURE APPLICATIONS;

CRACKS; DIELECTRIC PROPERTIES; ELECTRIC FIELDS; ENCAPSULATION; PACKAGING; PLASTICS; POWER ELECTRONICS; SILICON CARBIDE; SILICONES;

ELASTOMERS;

EID: 84893148762     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2013.2279997     Document Type: Article

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