Packaging technology for electronic applications in harsh high-temperature environments

IEEE Transactions on Industrial Electronics

Volumn 58, Issue 7, 2011, Pages 2673-2682

  Hagler, Ping ^a,b   Henson, Phillip ^a,b   Johnson, R Wayne ^a  

^a AUBURN UNIVERSITY   (United States)

^b ARMED FORCES INSTITUTE OF PATHOLOGY   (United States)

Author keywords

Die attach; harsh environment electronics; high temperature packaging; silicon nitride; wire bonding

Indexed keywords

BALL SHEAR; BARRIER LAYERS; BOND PAD; CERAMIC SUBSTRATES; DAISY-CHAIN RESISTANCE; ELECTRICAL RESISTANCES; ELECTROLESS NI; ELECTROLESS NI/IMMERSION AU; ELECTRONIC APPLICATION; FLEXURAL MODULUS; HARSH-ENVIRONMENT ELECTRONICS; HIGH-TEMPERATURE ENVIRONMENT; HIGH-TEMPERATURE PACKAGING; MULTIPLE DEVICES; PACKAGING TECHNOLOGIES; PLATING PROCESS; PULL FORCE; SILICON-ON-INSULATORS; SYSTEM IN PACKAGE; TERNARY EUTECTICS; THERMOSONIC WIRE BONDING; THICK-FILM TECHNOLOGY; WIRE BONDING; WIRE BONDS;

ALUMINUM; DIES; ELECTRONICS PACKAGING; EUTECTICS; GEOMORPHOLOGY; GOLD; METALLIZING; SHEAR STRENGTH; SILICON; SILICON NITRIDE; SILICON ON INSULATOR TECHNOLOGY; THERMAL EXPANSION;

WIRE;

EID: 79959314426     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIE.2010.2047832     Document Type: Article

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