Low-temperature and pressureless sintering technology for high-performance and hightemperature interconnection of semiconductor devices

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Lu, Guo Quan ^a   Calata, Jesus N ^a   Lei, Guangyin ^a   Chen, Xu ^b  

^a State University   (United States)

^b TIANJIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

LOW TEMPERATURE EFFECTS; NANOPARTICLES; SEMICONDUCTOR DEVICES; SILICON CARBIDE; SILVER; THERMODYNAMIC PROPERTIES;

HIGH TEMPERATURE INTERCONNECTION; PRESSURELESS SINTERING; SINTERED JOINTS;

SINTERING;

EID: 36348964807     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360066     Document Type: Conference Paper

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