Thermo-mechanical modelling of power electronics module structures

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 214-219

  Tilford, T ^a   Lu, H ^a   Bailey, C ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; DC GENERATORS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; POWER ELECTRONICS; PROJECT MANAGEMENT; QUALITY ASSURANCE; RELIABILITY; RELIABILITY ANALYSIS; TECHNOLOGY;

DESIGN ENVIRONMENTS; HIGH POWERS; HIGH-POWER OPERATIONS; INTEGRATED DESIGNS; MECHANICAL MODELLING; MODULE STRUCTURES; PACKAGING TECHNOLOGIES; POWER ELECTRONIC MODULES; POWER MODULES; RESEARCH PROJECTS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249162721     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342718     Document Type: Conference Paper

References (13)

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