High-temperature endurable encapsulation material

Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012

Volumn , Issue , 2012, Pages 61-66

  Chidambaram, Vivek ^a   Beng Yeung, Ho ^a   Sing, Chan Yuen ^a   Woo, Daniel Rhee Min ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA CERAMIC SUBSTRATES; BENZOCYCLOBUTENE; HIGH TEMPERATURE; HIGH-TEMPERATURE STORAGE; LOGGING EQUIPMENT; LOSS OF STRENGTH; MATERIAL DEGRADATION; SUBSTRATE MATERIAL;

ALUMINA; CERAMIC MATERIALS; CHIP SCALE PACKAGES; QUARTZ; SUBSTRATES; THERMAL AGING; WELL LOGGING;

ESTERS;

EID: 84879739819     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2012.6507052     Document Type: Conference Paper

References (3)

1. Chidambaram et. al " Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environments Application," J. Electronic Materials, Vol. 41, No. 8 (2012), pp. 2256-2266
2. Chidambaram et. al "Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics," J. Electronic Materials, Vol. 41, No. 8 (2012), pp. 21072117
3. E.H.Amalu et.al. "High TemperatureElectronics R & D Challenges and Trend in Materials, Packaging and Interconnection Technology," Proc. 2nd International Conference on Adaptive Science and Technology Conf, Ghana, Dec. 2009, pp. 146-153.