New conductive thick-film paste based on silver nanopowder for high power and high temperature applications

Microelectronics Reliability

Volumn 51, Issue 7, 2011, Pages 1235-1240

  Jakubowska, Małgorzata ^a,b   Jarosz, Mateusz ^a,b   Kiełbasinski, Konrad ^a,b   Młoniak, Anna ^a  

^a ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA SUBSTRATES; ELEVATED TEMPERATURE; HIGH CURRENTS; HIGH TEMPERATURE; HIGH-POWER; LOW RESISTIVITY; NANOSCALE SILVER; SILVER NANOPOWDER; SINTERABILITY; THICK-FILM MATERIALS;

HIGH TEMPERATURE APPLICATIONS; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; POLYIMIDES; POWDERS; SINTERING;

SILVER;

EID: 79958121889     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.04.015     Document Type: Conference Paper

References (17)

1. M. Jakubowska Investigation on a new silver photoimageable conductor Microelectron Reliab 48 6 2008 860 865
2. K. Pitt, and M. Jakubowska Low cost microwave thick film structures J Mater Sci: Mater Electron 16 5 2005 309 313 (Pubitemid 40843976)
3. ESL. < http://www.electroscience.com/silverconductorpastes.html >.
4. Ferro. < http://www.ferro.com/NR/rdonlyres/5FC956E6-B357-475F-9970- B6C81011ABF0/3660/SilverPastesProd-2006.pdf >.
5. ITME. < http://www.itme.edu.pl/tl-files/Oferta-Katalogi%20ogolne/ITME- Catalogue-2010.pdf >. p. 38-39.
6. ESL. http://www.electroscience.com/pdf/9912-K.pdf.
7. ESL. < http://www.electroscience.com/polymer.html >.
8. DuPont. < http://www2.dupont.com/MCM/en-US/assets/downloads/prodinfo/ PrintedElectronics-ProductOverview.pdf >.
9. Sung-hyun Park Fabrication of Pb-free silver paste and thick film adding silver nanoparticles Solid State Phenom 124-126 2007 639 642
10. Sung-hyun Park Electrical properties of silver paste prepared from nanoparticles and lead-free frit J Nanosci Nanotechnol 11 2007 3917 3919
11. US Patent Application, US 2007/0018140 A1.
12. Koji Abe Two-dimensional array of silver nanoparticles Thin Solid Films 327-329 1998 524 527 (Pubitemid 128635725)
13. H. Nagasawa Physical characteristics of stabilized silver nanoparticles formed using a new thermal-decomposition method Phys Status Solidi 1 2002 67 76 (Pubitemid 34685331)
14. M. Puchalski The study of silver nanoparticles by means of SEM, EDX, STM Mater Sci - Poland 2007 2
15. Q. Jiang, S. Zhang, and M. Zhao Size-dependent melting point of noble metals Mater Chem Phys 82 2003 225 227
16. Kyoung-Sik Moon, Hai Dong, Radenka Maric, Suresh Pothukuchi, Andrew Hunt, and Yi Li Thermal behavior of silver nanoparticles for low-temperature interconnect applications J Electron Mater 34 2 2005 175 186
17. ISO 15184:1998. Paints and varnishes - determination of film hardness by pencil.