Unusual observations in the wear-out of high-purity aluminum wire bonds under extended range passive thermal cycling

IEEE Transactions on Device and Materials Reliability

Volumn 10, Issue 2, 2010, Pages 254-262

  Agyakwa, Pearl A ^a   Corfield, Martin R ^a   Li, Jian Feng ^a   Loh, Wei Sun ^b   Liotti, Enzo ^c   Hogg, Simon C ^c   Johnson, C Mark ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^b UNIVERSITY OF SHEFFIELD   (United Kingdom)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Aluminum; Life estimation; Microstructure; Nanoindentation; Wire bonding

Indexed keywords

ALUMINUM WIRE BONDS; ANNEALING EFFECTS; BOND INTERFACE; BOND STRENGTH; COFFIN-MANSON; DAMAGE ACCUMULATION; EXTENDED RANGE; HIGH TEMPERATURE PHASE; HIGH-PURITY; LIFE ESTIMATION; LOW TEMPERATURE PHASE; LOWER PEAK TEMPERATURES; MICRO-STRUCTURAL; MICRO-STRUCTURAL CHARACTERIZATION; PURE ALUMINUM; REMOVAL MECHANISM; TEMPERATURE RANGE; WIRE BONDING; WIRE BONDS;

ALUMINUM; ANNEALING; ELECTRONICS PACKAGING; MICROSTRUCTURE; NANOINDENTATION; THERMAL CYCLING;

WIRE;

EID: 77953239010     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2010.2044796     Document Type: Article

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