Advantages and new development of direct bonded copper substrates

Microelectronics Reliability

Volumn 43, Issue 3, 2003, Pages 359-365

  Schulz Harder, Jürgen ^a  

^a Curamik Electronics GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CERAMIC MATERIALS; COPPER; HEAT RESISTANCE; METALLIZING; PRINTED CIRCUIT BOARDS; THERMAL CYCLING; THERMAL EXPANSION;

DIRECT BONDED COPPER (DBC) SUBSTRATES;

MULTICHIP MODULES;

EID: 0037371967     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00343-8     Document Type: Conference Paper

References (6)

1. Schulz-Harder J. DBC substrates with reduced ceramic thickness in power semiconductor modules, PCIM Power Conversion, No. 1 (1996) reprint.
2. Exel K. Ready for take off DBC on AlN for power semiconductor. PCIM Europe Power Electron. (11):1999;28-33.
3. Schulz-Harder J. HPS DBC substrates for high reliable applications. Poster at IMAPS Nordic, 2001.
4. Schulz-Harder J. Reliability of direct copper bonded (DBC) substrates. Proceedings of ISHM 11th European Microelectronics Conference, Venice, 1997.
5. Schulz-Harder J. DBC substrates as a base for power MCM's. Proceedings of EPTC 2000, Singapore.
6. Schulz-Harder J. Fluid cooled DBC substrates. PCIM Europe Power Convers. 3(2):1998;66-71.