Survey on high-temperature packaging materials for SiC-based power electronics modules

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn , Issue , 2007, Pages 2234-2240

  Coppola, L ^a,b   Huff, D ^a   Wang, F ^a   Burgos, R ^a   Boroyevich, D ^a  

^a Virginia Polytechnic Institute and State University   (United States)

^b ABB CORPORATE RESEARCH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ENCAPSULATION; HEAT STORAGE; POWER ELECTRONICS; SILICON; SILICON CARBIDE;

DIE ATTACH; HEAT SPREADERS; HIGH TEMPERATURE; HIGH-TEMPERATURE PACKAGING; SI DEVICES; SIC DEVICES;

PACKAGING MATERIALS;

EID: 48349093154     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2007.4342356     Document Type: Conference Paper

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