Nickel-tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles

IEEE Transactions on Power Electronics

Volumn 28, Issue 5, 2013, Pages 2448-2456

  Yoon, Sang Won ^a   Glover, Michael D ^b   Shiozaki, Koji ^a  

^a Toyota Motor North America Inc   (United States)

^b UNIVERSITY OF ARKANSAS   (United States)

Author keywords

Bonding processes; intermetallic; nickel; power electronics; power semiconductor devices; tin

Indexed keywords

ALLOY FORMATION; AUTOMOTIVE POWER ELECTRONICS; BOND AREAS; BONDING PROCESS; BONDING TECHNOLOGY; CONVENTIONAL POWER; ELECTRICAL ANALYSIS; ELECTRICAL PERFORMANCE; HIGH RELIABILITY; HIGH TEMPERATURE; LOW COSTS; LOW TEMPERATURES; OPERATIONAL POWER; POWER DEVICES; POWER SEMICONDUCTOR DEVICES; TLP BONDING; TRANSIENT LIQUID PHASE; TRANSIENT LIQUID PHASE BONDING;

AUTOMOBILE MANUFACTURE; ELECTRIC EQUIPMENT; ELECTRIC PROPERTIES; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); INTERMETALLICS; NICKEL; POWER ELECTRONICS; QUALITY CONTROL; RELIABILITY ANALYSIS; TIN; TIN ALLOYS; VEHICLES;

BONDING;

EID: 84870503974     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2012.2212211     Document Type: Article

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