Endurance of thin insulation polyimide films for high-temperature power module applications

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 5, 2013, Pages 811-817

  Khazaka, Rabih ^a   Locatelli, Marie Laure ^a   Diaham, Sombel ^a   Bidan, Pierre ^a  

^a d'Hydraulique et des Telecommunications   (France)

Author keywords

Accelerated aging; dielectric properties; endpoint criteria; insulating layer; polyimide endurance; temperature index; thermal aging; thermo oxidation

Indexed keywords

ACCELERATED AGING; DIELECTRIC STRENGTHS; ENDPOINT CRITERIA; HIGH-TEMPERATURE POWER; INSULATING LAYERS; SURFACE DEGRADATION; TEMPERATURE INDEX; THERMAL ENDURANCE;

DEGRADATION; ELECTRIC BREAKDOWN; POLYIMIDES; POLYMERIC FILMS; POWER ELECTRONICS; THERMAL AGING;

DIELECTRIC PROPERTIES;

EID: 84877584767     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2249559     Document Type: Article

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