Thick film modules for 300°C applications

Proceedings - 2006 IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2006

Volumn , Issue , 2006, Pages 118-124

  Palmer, Michael J ^a   Johnson, R Wayne ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Assembly; High temperature; Packaging; Thick film

Indexed keywords

C APPLICATION; CERAMIC SUBSTRATES; ELECTROLESS NI; FILM METALLIZATION; FUNCTIONAL SYSTEMS; HIGH TEMPERATURE; INTEGRATION AND PACKAGING; SILICONON-INSULATOR TECHNOLOGY (SOI);

ALUMINUM; ASSEMBLY; PACKAGING; PLATINUM; SUBSTRATES; THICK FILMS;

CHIP SCALE PACKAGES;

EID: 79959316985     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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