Die attach for high temperature electronics packaging

International Conference and Exhibition on High Temperature Electronics 2008, HiTEC 2008

Volumn , Issue , 2008, Pages 213-219

  Zheng, Ping ^a   Wiggins, Alberez ^a   Johnson, R Wayne ^a   Frampton, Robert V ^b   Adam, Steven J ^b   Peltz, Leora ^b  

^a AUBURN UNIVERSITY   (United States)

^b BOEING COMPANY   (United States)

Author keywords

Die attach; High temperature electronics; Packaging

Indexed keywords

AU BUMP; DIE-ATTACH; DIE-ATTACH MATERIALS; HIGH-TEMPERATURE ELECTRONICS; INITIAL FAILURE; SHEAR TESTS; THIN FILM METALLIZATION; TI DIFFUSION;

ALUMINUM NITRIDE; EUTECTICS; FAILURE MODES; GOLD; HIGH TEMPERATURE APPLICATIONS; METALLIZING; PACKAGING; SILICON CARBIDE; TIN;

ELECTRONICS PACKAGING;

EID: 78651331066     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Robert S. Okojie, Steve M. Page and Mitch Wolff, "Performance of MEMS-DCA SiC Pressure transducers under Various Dynamic Conditions," Proceedings of the 2006 International High temperature Electronics Conference, Santa Fe, NM, May 15-18, 2006, pp. 70-74.
2. R. Wayne Johnson, Cai Wang, Yi Liu, and James D. Scofield," Power Device Packaging Technologies for Extreme Environments," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 3, July 2007, pp. 182-191.
3. J. G. Bai, Z. Zhang, J. N. Calata, T. Lei, and G-Q Lu, "Low Temperature Sintering of Nanoscale Silver Paste: a Lead-free Die-attach Solution for High-performance and High-temperature Electronic Packaging," Proceedings of the 2006 International High temperature Electronics Conference, Santa Fe, NM, May 15-18, 2006, pp. 135-140.
4. oC Applications," Proceedings of the International High Temperature Electronics Conference, Santa Fe, NM, May 16-18, 2006, pp. 118-124.
5. Cai Wang, Yi Liu, Shyam Gale and Wayne Johnson, Volodymyr Bondarenko, Paul Martin, Michael S. Mazzola, Robin Kelley, and Janna Casady, "Characterization and Packaging of SiC JFET Power Modules for Extreme Environment Motor Drives," Proceedings of the International High Temperature Electronics Conference, Santa Fe, NM, May 16-18, 2006, pp. 448-456.
6. Simon Thomas, "Surface Enrichment of In in Evaporated Au-In Films," Applied Physiucs Letters, Vol. 24, no. 1, January 1974, pp. 1-3.
7. R. Wayne Johnson, Ping Zheng, Alberez Wiggins, Seymour Rubin and Leora Peltz, "High Temperature Electronics Packaging," Proceedings of the HITEN International Conference on High Temperature Electronics, St. Catherine's College Oxford, England, September 17-19, 2007.