A method to improve the reliability and the fatigue life of power device substrates

12th International Conference on Fracture 2009, ICF-12

Volumn 9, Issue , 2009, Pages 7307-7316

  Pietranico, S ^a,b   Pommier, S ^a   Lefebvre, S ^b   Pattofatto, S ^a  

^a UNIVERSITÉ PARIS SACLAY   (France)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE PARTS; BASE PLATES; CERAMIC LAYER; DIRECT BONDED COPPERS; ELECTRONIC POWER DEVICES; GEOMETRIC SINGULARITY; NATURAL DEFECT; OVERLOAD CYCLES; OVERLOAD RETARDATION; POWER DEVICES; POWER ELECTRONIC DEVICES; POWER MODULE; RISK OF FAILURE; SILICON DIE; TEMPERATURE VARIATION; THERMAL LOADINGS; THERMO-MECHANICAL; WEIBULL APPROACH;

BRITTLE FRACTURE; CERAMIC MATERIALS; ELECTRIC EQUIPMENT; ELECTRIC POWER SYSTEMS; FINITE ELEMENT METHOD; TEMPERATURE DISTRIBUTION; THERMAL FATIGUE;

SUBSTRATES;

EID: 84869754557     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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