Conductive adhesives for flip-chip applications

Advanced Flip Chip Packaging

Volumn 9781441957689, Issue , 2013, Pages 201-261

  Lu, Daoqiang Daniel ^a   Wong, C P ^b,c  

^a Henkel   (China)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^c Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES;

ADHESIVE FILM; ADHESIVE TECHNOLOGY; ANISOTROPIC CONDUCTIVE ADHESIVES; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; FLIP CHIP; FLIP CHIP APPLICATIONS; MATERIAL DEVELOPMENT; NONCONDUCTIVE ADHESIVES; RESEARCH ACHIEVEMENTS;

FLIP CHIP DEVICES;

EID: 84915798430     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-5768-9_6     Document Type: Chapter

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