Flip-chip packaging using micromachined conductive polymer bumps and alignment pedestals for MOEMS

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 5, Issue 1, 1999, Pages 119-126

  Oh, Kwang W ^a   Ahn, Chong H ^a   Roenker, Kenneth P ^a  

^a University of Cincinnati   (United States)

Author keywords

Conductive polymer bumps; Flip chip bonding; GaAs MSM photodetectors; Low temperature bonding; MOEMS; Optical I O couplers; Optical interconnections; Passive alignment

Indexed keywords

BONDING; CONDUCTIVE PLASTICS; ELECTRIC CONTACTS; ELECTRIC CURRENTS; ELECTRIC RESISTANCE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; PHOTODETECTORS; PHOTORESISTS; SEMICONDUCTING ALUMINUM COMPOUNDS;

FLIP-CHIP BONDING; MICROOPTOELECTROMECHANICAL SYSTEMS (MOEMS); OPTICAL INPUT/OUTPUT COUPLERS; PASSIVE ALIGNMENT;

FLIP CHIP DEVICES;

EID: 0032627353     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/2944.748115     Document Type: Article

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