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Volumn , Issue , 1999, Pages 488-492
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Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC IMPEDANCE;
ELECTRIC NETWORK ANALYSIS;
ELECTRIC NETWORK PARAMETERS;
ELECTRODES;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT TESTING;
NATURAL FREQUENCIES;
SUBSTRATES;
ANISOTROPIC CONDUCTIVE ADHESIVE FLIP CHIP INTERCONNECTIONS;
MICROWAVE MODEL;
THERMOCOMPRESSION BONDING;
INTERCONNECTION NETWORKS;
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EID: 0032639446
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
Times cited : (6)
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References (4)
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