Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 215-225

  Jagt, Jannes C ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Adhesive; Anisotropic; Climate tests; Crack formation; Electrically conductive adhesive; Failure causes; Isotropic; Oxidation; Reliability; Review; Surface mount technology

Indexed keywords

ADHESIVES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS;

ELECTRICALLY CONDUCTIVE ADHESIVES;

CONDUCTIVE MATERIALS;

EID: 0032090243     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705467     Document Type: Article

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