Bismuth-filled anisotropically conductive adhesive for flip chip bonding

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 147-152

  Vuorela, M ^a   Holloway, M ^b   Fuchs, S ^c   Stam, F ^c   Kivilahti, J ^a  

^a AALTO UNIVERSITY   (Finland)

^b Loctite Research and Development   (Ireland)

^c UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Anisotropic magnetoresistance; Bismuth; Bonding; Conductive adhesives; Contacts; Electric shock; Flip chip; Temperature; Testing; Tin

Indexed keywords

ADHESIVES; BISMUTH; BONDING; COATINGS; CONTACTS (FLUID MECHANICS); ELECTRONICS PACKAGING; ENHANCED MAGNETORESISTANCE; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; INTERMETALLICS; JOINING; MANUFACTURE; METALLURGY; RELIABILITY; SHOCK TESTING; SOLDERING; TEMPERATURE; TESTING; THERMAL SHOCK; TIN;

ANISOTROPICALLY CONDUCTIVE ADHESIVE; BONDING TEMPERATURES; CONDUCTIVE ADHESIVE; ELECTRIC SHOCK; FLIP CHIP; METALLURGICAL CHARACTERISTICS; PROCESS TEMPERATURE; SOLDER INTERCONNECTIONS;

ADHESIVE JOINTS;

EID: 84952305658     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860589     Document Type: Conference Paper

References (4)

1. J.K. Kivilahti and P. Savolainen, "Design and Modelling of Solder-filled ACAs for Flip-chip and Flexible Circuit Applications" in Conductive Adhesives for Electronics Packaging, Ed. by J. Liu, Electrochemical Publications Ltd., 1999, pp. 153-183.
2. R. Nagle, F. Stam, and J. Barrett, "Evaluation of Adhesive Based Flip-Chip Interconnect Techniques", International Journal of Microelectronics Packaging, Vol. 1, 1998, pp. 187-196.
3. D. Lu, Q.K. Tong and C.P. Wong, Mechanism Underlying the Unstable Contact Resistance of Conductive Adhesives, IEEE Transactions on Electronics Packaging Manufacturing, Vol 22, No. 3, July 1999, pp. 228-232.
4. J.C. Jagt, Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21, No. 2, June 1998, pp. 215-225.