Solder-free pressure contact micro-springs in high-density flip-chip packages

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1119-1126

  Chow, Eugene M ^a   Chua, Chris ^a   Hantschel, Thomas ^a   Van Schuylenbergh, Koenraad ^a   Fork, David K ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; PRESSURE EFFECTS; SOLDERING ALLOYS; THERMAL CYCLING;

ELECTRICAL PRESSURE CONTACTS; FLIP-CHIP PACKAGES; MICRO-SPRINGS;

ELECTRONICS PACKAGING;

EID: 24644483220     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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