Polymer flip chip technology on flexible substrates-development and applications

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 240-243

  Seidowski, Th ^a   Kriebel, F ^a   Neumann, N ^a  

^a KSW Microtec GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM ALLOYS; ELECTRONICS PACKAGING; ENVIRONMENTAL TECHNOLOGY; FILM THICKNESS; GOLD DEPOSITS; JOINING; METALLIZING; MICROPROCESSOR CHIPS; PALLADIUM; PLASTIC COATINGS; POLYMERS; SMART CARDS; SOLDERING ALLOYS;

CONDUCTIVE ADHESIVE; DEVELOPMENT AND APPLICATIONS; ENVIRONMENTAL FRIENDLINESS; FLEXIBLE SUBSTRATE; FLIP CHIP TECHNOLOGIES; ISOTROPIC CONDUCTIVE ADHESIVES; LOWER TEMPERATURES; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 84892302690     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742033     Document Type: Conference Paper

References (2)

1. F. Kulesza, R. Estes, "Solderless Flip Chip Technology"; Hybrid Circuit Technology, Feb. 1992, pp.24-27.
2. F. Kriebel, K. Melzer, E. Meusel, Th. Seidowski, "Electrical and Mechanical Properties of Flip Chip Connections Using Isotropic Conductive Adhesive", 2nd Int. Conf. Adhesive Joining Technology in Electronics Manufacturing