New flip-chip technology for high-density packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1069-1073

  Smith, Donald L ^a   Alimonda, Andrew S ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FABRICATION; LITHOGRAPHY; MAGNETRON SPUTTERING; PASSIVATION; SPUTTER DEPOSITION;

ELASTIC COMPLIANCE; FOUR POINT RESISTANCE; HIGH DENSITY PACKAGING;

FLIP CHIP DEVICES;

EID: 0029699624     PISSN: 05695503     EISSN: None     Source Type: None    
DOI: 10.1109/ECTC.1996.550814     Document Type: Article

References (3)

1. D. W Hoffman J. A. Thornton J. Vac. Sci. Technol. 20 355 1982
2. D. L. Smith Thin-Film Deposition: Principles and Practice 197 1995 McGraw-Hill
3. D. L. Smith Thin-Film Deposition: Principles and Practice 190 1995 McGraw-Hill