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Volumn 1998-September, Issue , 1998, Pages 137-143

Anisotropic conductive paste available for flip chip

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COATINGS; ELECTRODES; JOINING; MANUFACTURE; MOUNTINGS; PRODUCTIVITY;

EID: 84892824152     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742016     Document Type: Conference Paper
Times cited : (4)

References (3)
  • 2
    • 0030719328 scopus 로고    scopus 로고
    • Interconnection characteristics of anisotropic conductive paste
    • H. Nishimura et al: "Interconnection Characteristics of Anisotropic Conductive Paste", IEMT/IMC Proceedings 1997.
    • (1997) IEMT/IMC Proceedings
    • Nishimura, H.1
  • 3
    • 85044592922 scopus 로고    scopus 로고
    • Evaluation of adhesive flip chip bonding on flexible substrates
    • R. Aschenbrenner et al: "Evaluation of Adhesive Flip Chip Bonding on Flexible Substrates", Flexcon '97 Proceedings.
    • Flexcon '97 Proceedings
    • Aschenbrenner, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.