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Volumn 1998-September, Issue , 1998, Pages 137-143
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Anisotropic conductive paste available for flip chip
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Author keywords
[No Author keywords available]
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Indexed keywords
ANISOTROPY;
COATINGS;
ELECTRODES;
JOINING;
MANUFACTURE;
MOUNTINGS;
PRODUCTIVITY;
ANISOTROPIC CONDUCTIVE PASTES;
CONDUCTIVE PARTICLE;
FLIP-CHIP CONNECTIONS;
HIGHLY STABLES;
INSULATION PROPERTY;
LONG-TERM STORAGE;
PHYSICAL BONDING;
TWO ELECTRODES;
FLIP CHIP DEVICES;
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EID: 84892824152
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ADHES.1998.742016 Document Type: Conference Paper |
Times cited : (4)
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References (3)
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