Flip chip attach with thermoplastic electrically conductive adhesive

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 244-251

  Gaynes, M ^a   Kodnani, R ^a   Pierson, M ^a   Hoontrakul, P ^b   Paquette, M ^c  

^a IBM   (United States)

^b LEHIGH UNIVERSITY   (United States)

^c CASE WESTERN RESERVE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; INTEGRATED CIRCUIT INTERCONNECTS; JOINING; LAMINATES; LITHOGRAPHY; MANUFACTURE; REINFORCED PLASTICS;

BONDING TEMPERATURES; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVE MATERIALS; ELECTRICALLY CONDUCTIVE ADHESIVES; INTERCONNECT PERFORMANCE; PHOTOLITHOGRAPHY PROCESS; TEMPERATURE STABLE; TENSILE BOND STRENGTH;

FLIP CHIP DEVICES;

EID: 31744447847     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742034     Document Type: Conference Paper

References (7)

1. R. F. Saraf, J. M. Roldan, C. J. Sambucetti, M. A. Gaynes and R. Lewis, "High Performance Isotropic Polymer/Metal Composite for Interconnect Applications", Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium, Japan, pp. 425-428, 1995.
2. R. F. Saraf, J. M. Roldan, J. M. Jagannathan, C. J. Sambucetti, C. Marino, and J. Jahnes, "Polymer/Metal Composite for Interconnection Technology", Proceedings of the 45th Electronic Components and Technology Conference, Las Vegas, NV, pp. 1051-1053, 1995.
3. US Patent 5,478,700, "Application of Bonding Agents for Interconnection of Components to Carriers", October 15, 1996.
4. US Patent 5,759,737, Method of Making a Component Carrier", June 2, 1998.
5. D. Olliff, M. Gaynes, R. Kodnani and A. Zubeliwicz, "Characterizing the Failure Envelope of a Conductive Adhesive", Proceedings of the 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, pp. 124-127, 1997.
6. S. Sathe, B. Sammakia, R. Kodnani and M. Gaynes, "Study of the Thermal Characteristics of a Conductive Adhesive Chip Attach Process", Proceedings of the 47th Electronic Components and Technology Conference, San Jose, CA, pp. 1182-1187, 1997.
7. M. Gaynes, R. Lewis, R. Saraf and J. Roldan, "Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives", IEEE Transactions on Components, Packaging and Manufacturing Technology Part B, Vol. 18, pp. 299-304, May 1995.