Nano-Ag filled Anisotropic Conductive Adhesives (ACA) with self-assembled monolayer and sintering behavior for high performance fine pitch interconnect

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1147-1154

  Li, Grace Yi ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Isotropic and anisotropic conductive adhesives; Nano fillers; Self assembled monolayers (sams); Sintering

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); INTERFACIAL CONTACTS; ISOTROPIC AND ANISOTROPIC CONDUCTIVE ADHESIVES; NANO FILLERS; PHOTOACOUSTIC FOURIER TRANSFER INFRARED (FTIR);

ANISOTROPY; CONDUCTIVE MATERIALS; ELECTRIC CONTACTS; ELECTRONICS PACKAGING; FILLERS; LOW TEMPERATURE EFFECTS; MELTING; NANOSTRUCTURED MATERIALS; OPTICAL INTERCONNECTS; SELF ASSEMBLY; SILVER; SINTERING; THERMOGRAVIMETRIC ANALYSIS;

ADHESIVES;

EID: 24644496841     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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