Process and reliability characteristics of polymer flip chip assemblies utilizing stencil printed thermosets and thermoplastics

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 229-239

  Estes, R H ^a  

^a Polymer Flip Chip Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 71049144692     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742032     Document Type: Conference Paper

References (6)

1. Development of an Innovative Flip-Chip Bonding Technique using Micromachined Conductive Polymer Bumps. By: Kwang W. Oh and Chong H. Ahn University, of Cincinnati
2. Technology Assessment. By: Richard H. Estes
3. Experience of Working with Thermosetting and Thermoplastic Conductive Adhesives. By: Outi Rusanen and Virpi Pennanen, VTT Electronics
4. Reliability of Smart Card/IC Modules Assembled Using Polymer Flip Chip (PFC) Packaging. By: Mihalis Michael and Frank W. Kulesza
5. Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives. By: M.A. Gaynes, R.H. Lewis, R, Saraf, J. Roldan; IBM Corp.
6. Contact & Contactless Smart Card Assembly by Electrically Conductive Paste. By: Richard H. Estes