SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 31, Issue 6, 2002, Pages 551-556

Degradation mechanism of Ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure

(2) Yamashita, M a Suganuma, K a

a OSAKA UNIVERSITY (Japan)

Author keywords

Ag epoxy; Ag Sn intermetallic; Conductive adhesive; Diffusion; Sn Pb plating

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; DEGRADATION; DIFFUSION IN SOLIDS; EPOXY RESINS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; REACTION KINETICS; SILVER ALLOYS; TENSILE TESTING; TIN ALLOYS; TINNING;

HEAT EXPOSURE; INTERFACIAL DEBONDING; SILVER EPOXY CONDUCTIVE ADHESIVE; SILVER FILLERS; TIN LEAD PLATING;

INTERFACES (MATERIALS);

EID: 0036610377 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-002-0124-5 Document Type: Article

Times cited : (33)

References (20)

1
- 0009668487
- (1956) U.S. Patent 2,774,747
- Wolfson, H.¹ Elliott, G.²

2
- 84892281929
- ed. J. Kivilahti and M. Hyytiainen (Piscataway, NJ: IEEE)
- (2000) Proc. Adhesive in Electronics 2000 , pp. 216-220
- Komagata, M.¹ Toida, G.² Hocchi, T.³ Suzuki, K.⁴

3
- 0034476455
- (2000) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.23 , pp. 620
- Lu, D.¹ Wong, C.P.²

4
- 0034276193
- (2000) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.23 , pp. 462
- Dudek, R.¹ Berek, H.² Fritsch, T.³ Michel, B.⁴

5
- 0033320361
- (1999) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.22 , pp. 191
- Constable, J.H.¹ Kache, T.² Teichmann, H.³ Mühle, S.⁴ Gaynes, M.A.⁵

6
- 0032022322
- (1998) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.21 , Issue.PART A , pp. 18
- Kang, S.K.¹ Rai, R.S.² Purushothamann, S.³

7
- 0032026745
- (1998) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.21 , Issue.PART A , pp. 23
- Klosterman, D.¹ Li, L.² Morris, J.E.³

8
- 0032093904
- (1998) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.21 , Issue.PART A , pp. 252
- Suzuki, K.¹ Suzuki, O.² Komagata, M.³

9
- 0031100796
- (1997) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.20 , Issue.PART A , pp. 3
- Li, L.¹ Morris, J.E.²

10
- 0031094286
- (1997) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.20 , Issue.PART A , pp. 15
- Kotthaus, S.¹ Güther, B.H.² Häug, R.³ Schafer, H.⁴

11
- 0031098258
- (1997) IEEE Trans. Comp. Packag. Manuf. Technol. , vol.20 , Issue.PART A , pp. 21
- Liu, J.¹ Gustafsson, K.² Lai, Z.³ Li, C.⁴

12
- 84962291686
- ed. J.H. Constable (Piscataway, NJ: IEEE)
- (1998) Proc. 3rd Int. Conf. on Adhesive Joining and Coating Technology in Electronics Manufacturing, Adhesives in Electronics. '98 , pp. 351-355
- Suzuki, O.¹ Komagata, M.² Suzuki, K.³

13
- 0035311330
- (2001) Microelectron. J. , vol.32 , pp. 315
- Kim, H.K.¹ Shi, F.G.²

14
- 0033137732
- (1999) Synth. Met. , vol.102 , pp. 1428
- Bouguettaya, M.¹ Vedie, N.² Chevrot, C.³

15
- 0033739405
- (2000) Int. J. Adhesion Adhesive , vol.20 , pp. 189
- Lu, D.¹ Wong, C.P.²

16
- 0033221399
- (1999) J. Electron. Mater. , vol.28 , pp. 1314
- Kang, S.K.¹ Purushothamann, S.²

17
- 0033221458
- (1999) J. Electron. Mater. , vol.28 , pp. 1319
- Shearer, C.¹ Shearer, B.² Matijasevic, G.³ Gandhi, P.⁴

18
- 0343826637
- (2000) Microelectron. Reliability , vol.40 , pp. 1227
- Périchaud, M.G.¹ Delétage, J.Y.² Frémont, H.³ Danto, Y.⁴ Faure, C.⁵

19
- 0009668873
- (1978) Scripta Metall. , vol.367 , pp. 12
- Gas, P.¹ Bernardini, J.²

20
- 0016128836
- (1974) J. Biomed. Mater. Res. , vol.8 , pp. 381
- Okabe, T.¹ Hochman, R.F.² McLain, M.E.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.