Development of high conductivity lead (Pb)-free conducting adhesives

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 1, 1998, Pages 18-22

  Kang, Sung K ^a   Rai, Rajinder S ^b   Purushothaman, Sampath ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

Adhesive bonding; Anisotropically conductive film; Conducting adhesives; Conductive filler particles; Electrical resistance; Isotropic conduction; Lead (Pb) free conducting adhesives; Mechanical strength; Metallurgical bonding; Reworkability

Indexed keywords

CONDUCTIVE FILMS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; EPOXY RESINS; HEAT CONDUCTION; LEAD; PLASTIC ADHESIVES; PLASTICS FILLERS; SOLDERING; SUBSTRATES; THERMAL CYCLING; THERMOPLASTICS;

CONDUCTING ADHESIVES; CONDUCTIVE FILLER PARTICLES; ISOTROPIC CONDUCTION; METALLURGICAL BONDING; SOLDER INTERCONNECTIONS;

CONDUCTIVE PLASTICS;

EID: 0032022322     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.679027     Document Type: Article

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