Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 743-749

  Nysæther, Jon B ^b,c   Lai, Zonghe ^d,e   Liu, Johan ^a,d,e  

^a IEEE

^b UNIVERSITY OF OSLO   (Norway)

^c SINTEF   (Norway)

^d SWEREA IVF   (Sweden)

^e CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; EPOXY RESINS; FAILURE ANALYSIS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING;

FLIP CHIP ON BOARD CIRCUITS; ISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS; SOLDER BUMPS; SOLDER REFLOW; UNDERFILL MATERIAL;

FLIP CHIP DEVICES;

EID: 0034315837     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883767     Document Type: Article

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