Carbon nanotube vias for future LSI interconnects

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 251-253

  Nihei, Mizuhisa ^a   Horibe, Masahiro ^a   Kawabata, Akio ^a   Awano, Yuji ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; CHEMICAL VAPOR DEPOSITION; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; ELECTROMIGRATION; FABRICATION; OPTICAL INTERCONNECTS; THERMAL EFFECTS;

DIELECTRIC LAYERS; HOT FILAMENT CHEMICAL VAPOR DEPOSITION (HF-CVD); MULTIWALLED NANOTUBES (MWNT); SUBSTRATE TEMPERATURE;

LSI CIRCUITS;

EID: 8644228615     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. S. Iijima, Nature, Vol. 354, 1991, pp. 56.
2. Z. Yao, C. L. Kane and C. Dekker, Phys. Rev. Lett., Vol. 84, 2000, pp. 2941.
3. J. Hone, M. Whitney and A. Zettle, Synthetic Metals, Vol. 103, 1999, pp. 2498.
4. J. Kong, E. Yenilmez, T. W. Tombler, W. Kim and H. Dai, Phys. Rev. Lett., Vol. 87, 2001, pp. 106801.
5. M. Nihei, A. Kawabata and Y. Awano, Jpn. J. Appl. Phys., Vol. 42, 2003, pp. L721.
6. W. Hoenlein, Proc. International Microprocesses & Nanotechnology Conference 2001, 2001, p. 76.
7. J. Li, Q. Ye, A. Cassell, J. Koehne, H. T. Hg, J. Han and M. Meyyappan, IEEE International Interconnect Conference 2003, pp.271.
8. M. Nihei, A. Kawabata, M. Horibe and Y. Awano, Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials, 2003, pp. 798
9. Y. Zhang, T. Ichihashi, E. Landree, F. Nihey and S. Iijima, Science, Vol. 285, 1999, pp. 1719.
10. S. Sato, A. Kawabata, M. Nihei and Y. Awano, Chem. Phys. Lett., Vol. 382, 2003, pp. 361.