Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 191-199

  Constable, James H ^a   Kache, Thomas ^a   Teichmann, Heiko ^a   Mühle, Sven ^a   Gaynes, Michael A ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; CONDUCTIVE MATERIALS; COPPER; ELECTRIC RESISTANCE; FATIGUE OF MATERIALS; FATIGUE TESTING; METALLIZING; MICROELECTRONICS;

ELECTRICAL RESISTANCE MONITORING; ISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS; PULL STRENGTH;

ELECTRONICS PACKAGING;

EID: 0033320361     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774731     Document Type: Article

References (6)

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2. T. M. Niu, E. J. Burke, W. E. Black, and J. R. Case, "6-axis submicron fatigue tester," in Proc. ASME/JSME Conf. Electron. Packag., Milpitas, ÇA, 1992, vol. 2, pp. 937-945(b).
3. J. H. Constable and C. Lizzul, "An investigation of solder joint fatigue using electrical resistance spectroscopy," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 18, pp. 142-152, Mar. 1995.
4. R. Holm, Electric Contacts. New York: Springer-Verlag, 1967.
5. M. A. Gaynes, L. J. Matienzo, J. A. Zimmerman, and D. Vanhart, "Analysis and characterization of electrically conductive adhesives," in Proc. Mater. Res. Symp., 1997, vol. 445, pp. 139-151.
6. P. A. Engel, Impact Wear of Materials. New York: Elsevier, 1986.