Development of 0.025 mm pitch anisotropic conductive film

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1998, Pages 1042-1046

  Hotta, Yuji ^a   Maeda, Masako ^a   Asai, Fumiteru ^a   Eriguchi, Fuyuki ^a  

^a NITTO DENKO CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; SOLDERING; ANISOTROPY; CONDUCTIVE FILMS; NETWORK COMPONENTS;

ANISOTROPIC CONDUCTIVE FILMS (ACF);

CONDUCTIVE FILMS; FLIP CHIP DEVICES;

ANISOTROPIC CONDUCTING ADHESIVES; ANISOTROPIC CONDUCTIVE FILMS; FLIP-CHIP INTERCONNECTION; PRINT CIRCUIT BOARDS;

EID: 0031628844     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)