Behavior of electronically conductive filled adhesive joints under cyclic loading part 1: Experimental approach

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 6-12

  Gomatam, R ^a   Sancaktar, E ^a  

^a University of Akron   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; COSTS; CURVE FITTING; CYCLIC LOADS; DEGRADATION; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; OPTICAL INTERCONNECTS; SCANNING ELECTRON MICROSCOPY; STRESSES; TEMPERATURE;

ELCTRONICALLY CONDUCTIVE ADHESIVE (ECA);

ADHESIVE JOINTS;

EID: 0035020707     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)